Secon has been a manufacturer of plasma equipment for diode manufacturers and wafer fabrication lines in the semiconductor industry for 20 years. All equipment is based on two technically leading developments, the patented XRG - 800 radical generator (a high efficient source for plasma with a very high density) and the high rate etch source XRG - 900, which can remove large quantities of materials at high speed.

To date, these radical generators provide the highest plasma density, the best yield of radicals and the least proportional of unwanted side effects, of all the available sources. Radicals offer immense advantages to the manufacturers of semiconductor devices, e.g.

• Absolutely damage-free isotropic etching with unmatched high etch rates
• Anisotropic etching with extremely low ion damages in the RIE/CDE mode, a combination of RIE (Reactive Ion Etching) and CDE (Chemical Dry Etch), etching with radicals.

With these advanced technologies new applications can be offered to semiconductor manufacturers, which can lead to better product quality at reduced cost of ownership. These application are directed at three different markets,

• Diode Etching and passivation
• Wafer backside etching and damage etching
• Wafer thinning

Application By Using XRG-800 Microwave Radical Generator

 

Application By Using XRG-900 Microwave Radical Generator

	Etch	Deposition
Diodes	Moat Etch	Passivation by coating of Si3N4 or Amorphous Si
Equipment	XPL - 900, XCD - 72X	XPL - 900, XCD - 72X
Solar Substrates	Thinning, Structuring, Edge Etch	Antireflective Nitride (SiH4 + N2 + H2)
Equipment	XPL - 900, XCD - 72X	XPL - 900, XCD - 72X
IC Wafers	Thinning including damage etch
Equipment	XPL - 900

Note: XCD or XED: Barrel type system; XPL: Single wafer type system.

 

 

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Copyright © 2002 Secon Semiconductor Equipment (M) Sdn. Bhd.
Last modified: Juli 03, 2002